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01:19:53
The Origins of Silicon Valley: Characteristics of a Startup Environment
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Showing 89 - 110 of 128
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Welcome to REPP 2021 (Symposium on Reliability of Electronics and Photonics Packaging)
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Adding Stretchability to Flexible Hybrid Electronics by using Metal Gel Interconnects
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Sustainable Electronics – From Dumped E-Waste To A Circular Economy: What Is Needed?
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01:19:53
The Origins of Silicon Valley: Characteristics of a Startup Environment
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Package Technology, Design, And Methodology Challenges And Solutions For High Bandwidth Electronic Systems
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Electromigration Failure of Solder Interconnects under Non-DC Conditions
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Scalable Highly-Integrated Photonics Packaging for the 5G World: From Datacenters to Drones
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Bonding Technology for the Next Generation Integration Schemes
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3D Packaging for Superconducting Qubits
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The Origins of Silicon Valley: Why and How It Happened, and Lessons for Tech Hubs
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Working Group Meeting 3: 2021 IEEE Heterogeneous Integration Roadmap
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Working Group Meeting 4: 2021 IEEE Heterogeneous Integration Roadmap
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Working Group Meeting 2: 2021 IEEE Heterogeneous Integration Roadmap
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Working Group Meeting 1: 2021 IEEE Heterogeneous Integration Roadmap
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Wrap-up & Charge to the Heterogeneous Integration Roadmap Teams
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