Additive Manufacturing Technologies for Custom-made Electronic Packaging -– Processes and Reliability

(36:10 +Q&A) - Prof. Ricky Lee, Hong Kong University of Science and Technology (HKUST).

Summary: Photolithography has been the mainstream technology for microelectronics fabrication for decades. Although it offers high throughput for mass production, sophisticated facilities such as lithography systems, photo masks, and etching benches are required. For prototyping and small/medium production, photolithography may not be the ideal choice in terms of cost and lead time. With advances of printing technologies in recent years, additive manufacturing (AM) has become a competitive option for prototyping and small/medium production. This presentation will introduce the development of AM and its advantages for microelectronics fabrication. Examples of applications in chip level re-distribution layer and bumping will be given. Relevant reliability issues and test results will be presented. Potential opportunities for future printed electronics will be discussed.

Dr. Ricky Lee received his PhD degree in Aeronautical & Astronautical Engineering from Purdue University. He joined the Hong Kong University of Science & Technology (HKUST) in 1993. Currently Dr Lee is Chair Professor of Smart Manufacturing, Executive Director of Shenzhen Platform Development Office, Director of Electronic Packaging Laboratory, and Director of Foshan Research Institute for Smart Manufacturing at HKUST. He also has concurrent appointments as the Acting Dean of Systems Hub at the HKUST Guangzhou Campus and Director of HKUST LED-FPD Technology R&D Center at Foshan, Guangdong, China. Dr Lee has been focusing his research on the technology development for electronics/optoelectronics packaging and additive manufacturing. The topics of his R&D interests include wafer level packaging and heterogeneous integration, 3D printing for microsystems packaging, LED packaging for solid-state lighting and applications beyond lighting, lead-free soldering and reliability analysis. The research outcomes of Dr Lee’s group have been documented in numerous technical papers in international journals and conference proceedings. He also co-authored 4 books and 10 book chapters. Due to his technical contributions, Dr Lee received many honors and awards over the years. In addition to being the recipient of 15 best/outstanding paper awards and 7 major professional society awards, Dr Lee is Fellow of IEEE, ASME, IMAPS, and Institute of Physics (UK). He is also Editor-in-Chief of ASME Journal of Electronic Packaging.

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